M7AFS600-1FGG256 vs M7AFS600-1FGG256I Vergleich
Detaillierter Direktvergleich von M7AFS600-1FGG256 von Microchip Technology und M7AFS600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | M7AFS600-1FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $0,00 |
| Family | Fusion (Mixed-Signal FPGA) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K | 600K |
| Fabric Elements (Registers) | 110592 | — |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) | — |
| Speed Grade | -1 | -1 |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Gehäuse | 256-LBGA (FPBGA-256, 17x17 mm) | — |
| Montageart | Surface Mount | — |
| Configuration | Flash-based, nonvolatile, live at power-up | — |
| Betriebstemperatur | 0C to +70C (commercial) | — |
| Maximum Frequency | [DATA_NEEDED: maximum fabric/system frequency] | — |
| Number of I/O | [DATA_NEEDED: user I/O count for FGG256] | 119 |
| Analog Peripherals | [DATA_NEEDED: ADC channel count and resolution] | — |
| On-chip RTC / POR | [DATA_NEEDED: RTC/POR availability details] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Core | — | ARM CoreMP7 |
| Betriebsversorgungsspannung | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| System Performance | — | Up to 350 MHz |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Gehäuse / Bauform | — | 256-Ball FBGA (FGG256) |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |