M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
MPN: M7AFS600-1FGG256 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $104 | $52,000.00 |
| 1,000 | $92 | $92,000.00 |
Drop-in alternatives for M7AFS600-1FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-FGG256
✅ Drop-In✓ In Stock
$232.4 / Unit
View Datasheet →M7AFS600-FG256
✅ Drop-In✓ In Stock
$198.75 / Unit
View Datasheet →M7AFS600-FG256I
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Contact for price
View Datasheet →M7AFS600-1FGG484I
✅ Drop-In✓ In Stock
$228 / Unit
View Datasheet →M1AFS600-FG256
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$22 / Unit
View Datasheet →A3P600-1FG256I
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$41.8 / Unit
View Datasheet →A3P600-1FG256
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$51.28 / Unit
View Datasheet →M7AFS600-1FGG256 Maximum Ratings & Electrical Characteristics
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 600K |
| Fabric Elements (Registers) | 110592 |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) |
| Speed Grade | -1 |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Package | 256-LBGA (FPBGA-256, 17x17 mm) |
| Mounting Type | Surface Mount |
| Configuration | Flash-based, nonvolatile, live at power-up |
| Operating Temperature | 0C to +70C (commercial) |
M7AFS600-1FGG256 256-lbga (fpbga-256, 17x17 mm) Pin Configuration Guide
Complete pinout information for M7AFS600-1FGG256 (256-lbga (fpbga-256, 17x17 mm) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-1FGG256.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-1FGG256 is suitable for 6 applications: Embedded System Controller, Power Supply and Board Health Monitoring, Industrial Automation Interfaces, Portable Instrumentation, Networking and Line-Card Control, Legacy Design Sustainment.
Embedded System Controller
The M7AFS600-1FGG256 consolidates an MCU, programmable logic, and power-supply supervision into one chip, which is why it fits board-level embedded system control. The hard ARM CoreMP7 runs the firmware while 110592 fabric registers implement custom interfaces, state machines, and glue logic that a standalone MCU cannot serve. Because the fabric is flash-based, the controller is live within microseconds of power application - no boot delay from an external configuration device. In a typical topology the CoreMP7 executes control loops over an AMBA bus while fabric logic drives UART, SPI, and GPIO to sensors and actuators, and the Fusion analog block supervises multiple supply rails via the on-chip ADC, enabling one 17x17 mm BGA to replace a three-chip solution.
Recommended
Power Supply and Board Health Monitoring
Fusion was architected specifically for power-system management: the analog block provides a multi-channel ADC, RTC, and monitor pins that observe voltage rails, temperature, and fan speeds, making the M7AFS600-1FGG256 ideal for board health monitoring. The 1.5V-core, flash-based device reads rail voltages through the on-chip ADC, compares them against thresholds in fabric logic, and asserts alarms or sequenced shutdown via dedicated I/O - all without an external analog front end. Because configuration is nonvolatile, monitoring starts at power-up before any processor boot completes, catching early brown-out events. Designers typically allocate a small fabric state machine for trip-point latching and use the CoreMP7 for logging over UART, achieving sub-millisecond fault response in server, storage, and telecom shelf hardware.
Recommended
Industrial Automation Interfaces
Industrial I/O modules, motor-control panels, and PLC daughter cards benefit from the M7AFS600-1FGG256's mix of deterministic fabric logic and embedded processing. The 600K-gate fabric implements multiple protocol interfaces (SPI, UART, bit-banged fieldbus framing) in parallel, while the ARM CoreMP7 handles higher-level communication stacks - a partition that a single MCU cannot achieve at this integration level. Flash-based fabric survives industrial power cycling without reconfiguration and provides instant-on outputs, important for safety interlocks. The commercial 0C to +70C rating of this suffix suits enclosed control cabinets; for unconditioned factory-floor environments select the -I industrial variant. Integration of the analog monitor block also allows the same chip to track cabinet temperature and supply rails, reducing discrete supervisor count.
Recommended
Portable Instrumentation
Handheld and bench instruments need logic density, processing, and low standby complexity in a compact footprint - the 17x17 mm FPBGA-256 M7AFS600-1FGG256 delivers all three. The instant-on flash fabric lets the instrument's user interface and safety interlocks be active the moment batteries connect, while the CoreMP7 runs the measurement application. The Fusion ADC and RTC support time-stamped logging of probe or sensor inputs without a separate real-time clock chip. Because no external configuration PROM is needed, the BOM stays small enough for compact two-sided boards. Designers should budget the 1.5V core regulator efficiency for battery life and verify the commercial temperature range against the instrument's specified operating envelope before finalizing this suffix.
Recommended
Networking and Line-Card Control
Telecom and datacom line cards use the M7AFS600-1FGG256 as the shelf-management and hot-swap control device. The fabric implements custom backplane signaling and LED/gearbox interfaces at deterministic latency, while the CoreMP7 runs IPMI-style management firmware over UART or I2C to the shelf controller. The analog monitor block supervises the numerous rails typical of line cards, and nonvolatile configuration means the card asserts management presence immediately at insertion - a requirement for controlled hot-swap sequencing. The 600K-gate capacity comfortably hosts multiple redundant interfaces. The -1 speed grade is sufficient because line-card management logic rarely stresses fabric timing; verify only high-speed interface constraints in Libero timing reports.
Recommended
Legacy Design Sustainment
Many deployed systems - medical devices, test equipment, industrial controllers - were built around Actel Fusion and now face component sourcing risk. The M7AFS600-1FGG256 and its pin-compatible siblings (M7AFS600-FGG256, M7AFS600-FG256I) allow sustained production without PCB re-spin because all share the 256-ball FGG256 footprint and the same die. An existing design bitstream can typically be reused after speed-grade and temperature-range verification. Distributors such as Micro-Semiconductor reported 637 pcs in stock as of the 2026-09 snapshot, and Octopart aggregates 5 supply sources, so lifecycle-risk buyers should secure last-time-buy quantities while coordinating a longer-term migration path to Microchip SmartFusion2 for future designs.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-1FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG256 | M7AFS600-FG256I | M1AFS600-FG256 | A3P600-1FG256I |
|---|---|---|---|---|---|
| Package | FPBGA-256 (17x17 mm) | FPBGA-256 - same | FPBGA-256 - same | FPBGA-256 - same | FBGA-256 - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 1M-class AFS600 | 600K |
| Embedded Processor | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | None (soft cores only) |
| Analog Peripherals | Yes (Fusion ADC/RTC/POR) | Yes | Yes | Yes | No |
| Configuration | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile |
| Operating Temperature | 0C to +70C | [DATA_NEEDED] | -40C to +100C (industrial) | [DATA_NEEDED] | -40C to +100C (industrial) |
| Fabric Elements | 110592 | 110592 | 110592 | [DATA_NEEDED] | [DATA_NEEDED] |
| Process Technology | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash |
Key Differentiators
- Hard ARM CoreMP7 processor integrated on-die (vs A3P600-1FG256I)
- Analog peripherals (ADC, RTC, POR) on-chip (vs A3P600-1FG256)
- Cost-optimized commercial suffix (vs M7AFS600-FG256I)
Design Notes
The M7AFS600 requires a 1.5V core supply plus 3.3V I/O/auxiliary rails. Plan power-up sequencing carefully: although the flash fabric is live at power-up, Microchip documentation specifies rail sequencing constraints for Fusion devices to avoid latch-up on the 130nm process. Use a supervisor or the Fusion's own analog POR block to gate downstream loads. Estimated: a 600K-gate design drawing tens of mA on the core rail is well within a small buck converter's capability; budget I/O current separately per bank.
A 17x17 mm 256-ball BGA dissipates heat primarily through the ball array into the PCB. For the -1 speed grade at commercial temperatures, typical Fusion designs of moderate utilization rarely need heatsinking, but perform a junction-temperature estimate using the package theta-JA from the manufacturer datasheet for your layer stack (4-layer vs 2-layer changes results substantially). Keep high-activity fabric regions distributed rather than clustered to avoid localized hot spots, and verify TC against the 0C to +70C ambient rating of this suffix.
Three frequent mistakes with Fusion designs: (1) treating this as an SRAM FPGA and adding an unnecessary configuration flash - the fabric is nonvolatile; (2) ignoring speed-grade derating when substituting ordering codes - M7AFS600-1FGG256 (-1) is slower than -2 grades, so re-run timing closure in Microchip Libero SoC after any substitution; (3) mixing the commercial suffix into designs needing industrial temperature - order M7AFS600-FG256I instead. Also confirm JTAG programming chain voltage levels match 3.3V I/O banks.
Compliance Information
Compliance data not stated in the retrieved distributor snippets; consult the Microchip product page environmental datasheet for RoHS/REACH status of this specific ordering code.
