M7AFS600-FGG256I vs AFS600-2FGG256 Comparison

Detailed side-by-side comparison of M7AFS600-FGG256I by Microchip Technology and AFS600-2FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Active
Microchip Technology
AFS600-2FGG256 AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 ✓ Active

Specification Comparison

Parameter M7AFS600-FGG256I AFS600-2FGG256
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Fusion Mixed-Signal FPGA —
System Gates 600K Approximately 600,000 gates
User I/O 119 —
Package 256-LBGA (FBGA), 1 mm ball pitch 256-LBGA
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
Operating Temperature Range -40C to +85C (industrial grade standard range) —
Mounting Type Surface Mount SMD/SMT
Packaging Tray Tray
MSL Level [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Product Type — Fusion mixed-signal FPGA
Configurable Logic Blocks — 13,824 CLBs
Reported Logic Elements — 7,000 LE
Number of I/O — 119 I/O
Package Pin Count — 256 balls
Package Pitch — 1.0 mm
Operating Supply Voltage — 1.5 V
Operating Temperature — 0°C to +70°C
Metal Layers — 7 layers
Configuration Memory — Nonvolatile flash
Power-Up Feature — Live at Power-Up
Maximum DDR Data Rate — 700 Mbps
I/O Features — Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down
RoHS Status — RoHS compliant
Lead-Free Status — Lead free

Datasheets & Resources

Browse All Products Create BOM Request Quote