M7AFS600-FGG256I vs AFS600-2FGG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256I sa pamamagitan ng Microchip Technology at AFS600-2FGG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ NakahandaMicrochip Technology
AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-FGG256I | AFS600-2FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | Approximately 600,000 gates |
| User I/O | 119 | — |
| Packhaging | 256-LBGA (FBGA), 1 mm ball pitch | 256-LBGA |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Hanay ng Temperature na Operasyon | -40C to +85C (industrial grade standard range) | — |
| Uri ng Pagpapasok | Surface Mount | SMD/SMT |
| Packaging | Tray | Tray |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Product Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| Reported Logic Elements | — | 7,000 LE |
| Number of I/O | — | 119 I/O |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| Supply Voltage na Operasyon | — | 1.5 V |
| Temperature na Operasyon | — | 0°C to +70°C |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash |
| Power-Up Feature | — | Live at Power-Up |
| Maximum DDR Data Rate | — | 700 Mbps |
| I/O Features | — | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down |
| Tindminan RoHS | — | RoHS compliant |
| Lead-Free Status | — | Lead free |