M7AFS600-FGG256I vs AFS600-2FGG256 Comparaison
Comparaison détaillée côte à côte de M7AFS600-FGG256I par Microchip Technology et AFS600-2FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ ActifMicrochip Technology
AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG256 ✓ ActifComparaison des spécifications
| Paramètre | M7AFS600-FGG256I | AFS600-2FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | Approximately 600,000 gates |
| User I/O | 119 | — |
| Boîtier | 256-LBGA (FBGA), 1 mm ball pitch | 256-LBGA |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Plage de température de fonctionnement | -40C to +85C (industrial grade standard range) | — |
| Type de montage | Surface Mount | SMD/SMT |
| Packaging | Tray | Tray |
| Niveau MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Product Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| Reported Logic Elements | — | 7,000 LE |
| Number of I/O | — | 119 I/O |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| Tension d'alimentation de fonctionnement | — | 1.5 V |
| Température de fonctionnement | — | 0°C to +70°C |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash |
| Power-Up Feature | — | Live at Power-Up |
| Maximum DDR Data Rate | — | 700 Mbps |
| I/O Features | — | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down |
| Statut RoHS | — | RoHS compliant |
| Lead-Free Status | — | Lead free |