MC9RS08KA8CWJ vs MC9RS08KB4CWJ Comparison

Detailed side-by-side comparison of MC9RS08KA8CWJ by NXP Semiconductors and MC9RS08KB4CWJ by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9RS08KA8CWJ MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KA8CWJ ⚠ Last Time Buy
NXP Semiconductors
MC9RS08KB4CWJ MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ ✗ End of Life

Specification Comparison

Parameter MC9RS08KA8CWJ MC9RS08KB4CWJ
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy End of Life
Stock Status In Stock In Stock
Unit Price (USD) $1.68 $1.49
Core Architecture RS08 (8-bit, HC08 subset) —
Data Bus Width 8 bit 8-bit
Program Memory Size 8 KB Flash 4 KB (4K x 8) Flash
Maximum CPU Frequency 20 MHz —
Operating Voltage Range 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) —
Number of I/O Pins 18 —
Package 20-SOIC Wide (20-SOIC W, Tube) 20-pin SOIC (wide-body, tube)
Mounting Type Surface Mount (SMD/SMT) Surface Mount
Pin/Package Count 20 pins —
Operating Temperature Range -40 C to +85 C (Industrial) —
Instruction Set Subset of HC08 with added BGND instruction HC08 subset + BGND
Peripherals Keyboard Interface (KBI), Timers, Internal Clock Source LVD, POR, PWM, WDT
Packaging Method Tube —
RoHS Status [DATA_NEEDED: RoHS status from data] [DATA_NEEDED: RoHS compliance status]
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL moisture sensitivity level]
Core Processor — RS08
Core Size — 8-bit
CPU Speed — 20 MHz
RAM Size — 126 B
EEPROM Size — None (Flash-based)
Number of I/O — 18
Supply Voltage Range — 2.5 V to 5.5 V
Connectivity — I2C, SPI
Operating Temperature — -40C to +85C
Debug Interface — Background Debug Mode (BDM)

Datasheets & Resources

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