MC9RS08KA8CWJ vs MC9RS08KB4CWJ Comparação
Comparação detalhada lado a lado de MC9RS08KA8CWJ por NXP Semiconductors e MC9RS08KB4CWJ por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Última compraNXP Semiconductors
MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP
MC9RS08KB4CWJ ✗ Fim de vidaComparação de especificações
| Parâmetro | MC9RS08KA8CWJ | MC9RS08KB4CWJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1,68 | $1,49 |
| Core Architecture | RS08 (8-bit, HC08 subset) | — |
| Largura do barramento de dados | 8 bit | 8-bit |
| Program Memory Size | 8 KB Flash | 4 KB (4K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | — |
| Operating Voltage Range | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) | — |
| Number of I/O Pins | 18 | — |
| Encapsulamento | 20-SOIC Wide (20-SOIC W, Tube) | 20-pin SOIC (wide-body, tube) |
| Tipo de montagem | Surface Mount (SMD/SMT) | Surface Mount |
| Pin/Package Count | 20 pins | — |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) | — |
| Instruction Set | Subset of HC08 with added BGND instruction | HC08 subset + BGND |
| Peripherals | Keyboard Interface (KBI), Timers, Internal Clock Source | LVD, POR, PWM, WDT |
| Packaging Method | Tube | — |
| Status RoHS | [DATA_NEEDED: RoHS status from data] | [DATA_NEEDED: RoHS compliance status] |
| Nível MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| RAM Size | — | 126 B |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Supply Voltage Range | — | 2.5 V to 5.5 V |
| Connectivity | — | I2C, SPI |
| Temperatura de operação | — | -40C to +85C |
| Debug Interface | — | Background Debug Mode (BDM) |