MC9RS08KA8CWJ vs MC9RS08KB4CWJ 对比
详细并排对比 MC9RS08KA8CWJ 出自 NXP Semiconductors 和 MC9RS08KB4CWJ 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9RS08KA8CWJ | MC9RS08KB4CWJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.68 | $1.49 |
| Core Architecture | RS08 (8-bit, HC08 subset) | — |
| 数据总线宽度 | 8 bit | 8-bit |
| Program Memory Size | 8 KB Flash | 4 KB (4K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | — |
| Operating Voltage Range | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) | — |
| Number of I/O Pins | 18 | — |
| 封装 | 20-SOIC Wide (20-SOIC W, Tube) | 20-pin SOIC (wide-body, tube) |
| 安装类型 | Surface Mount (SMD/SMT) | Surface Mount |
| Pin/Package Count | 20 pins | — |
| 工作温度范围 | -40 C to +85 C (Industrial) | — |
| Instruction Set | Subset of HC08 with added BGND instruction | HC08 subset + BGND |
| Peripherals | Keyboard Interface (KBI), Timers, Internal Clock Source | LVD, POR, PWM, WDT |
| Packaging Method | Tube | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status from data] | [DATA_NEEDED: RoHS compliance status] |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| RAM Size | — | 126 B |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Supply Voltage Range | — | 2.5 V to 5.5 V |
| Connectivity | — | I2C, SPI |
| 工作温度 | — | -40C to +85C |
| Debug Interface | — | Background Debug Mode (BDM) |