MC9RS08KA8CWJ vs MC9RS08KB4CWJ Vergleich
Detaillierter Direktvergleich von MC9RS08KA8CWJ von NXP Semiconductors und MC9RS08KB4CWJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP
MC9RS08KB4CWJ ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC9RS08KA8CWJ | MC9RS08KB4CWJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,68 | $1,49 |
| Core Architecture | RS08 (8-bit, HC08 subset) | — |
| Datenbusbreite | 8 bit | 8-bit |
| Program Memory Size | 8 KB Flash | 4 KB (4K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | — |
| Operating Voltage Range | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) | — |
| Number of I/O Pins | 18 | — |
| Gehäuse | 20-SOIC Wide (20-SOIC W, Tube) | 20-pin SOIC (wide-body, tube) |
| Montageart | Surface Mount (SMD/SMT) | Surface Mount |
| Pin/Package Count | 20 pins | — |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial) | — |
| Instruction Set | Subset of HC08 with added BGND instruction | HC08 subset + BGND |
| Peripherals | Keyboard Interface (KBI), Timers, Internal Clock Source | LVD, POR, PWM, WDT |
| Packaging Method | Tube | — |
| RoHS-Status | [DATA_NEEDED: RoHS status from data] | [DATA_NEEDED: RoHS compliance status] |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| RAM Size | — | 126 B |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Supply Voltage Range | — | 2.5 V to 5.5 V |
| Connectivity | — | I2C, SPI |
| Betriebstemperatur | — | -40C to +85C |
| Debug Interface | — | Background Debug Mode (BDM) |