MC9S08DN60ACLH vs MC9S08DV128CLH Comparison

Detailed side-by-side comparison of MC9S08DN60ACLH by NXP Semiconductors and MC9S08DV128CLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
MC9S08DV128CLH MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH ✓ Active

Specification Comparison

Parameter MC9S08DN60ACLH MC9S08DV128CLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $5.21 $4.42
Core HCS08 (S08 core) —
Data Bus Width 8 bit 8-bit
CPU Frequency 40 MHz 40 MHz
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) 6 KB (6K x 8)
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 —
Package / Case 64-LQFP (10x10 mm) —
Mounting Type Surface Mount Surface Mount
ADC 16-channel, 12-bit, 2.5 us conversion —
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External External
Interrupt Sources Up to 32 Up to 32
Operating Temperature -40C to +85C [DATA_NEEDED: confirm automotive grade range] —
Packaging Tray Tray
RoHS Status Compliant Compliant
Instruction Set HC08 + BGND instruction HC08 with BGND addition
On-Chip Debug BDM (Background Debug Mode) —
Core Architecture — HCS08 (enhanced S08 core)
Internal Bus Frequency — 20 MHz
Program Memory Size — 128 KB (128K x 8) Flash
Number of I/O Pins — 53
Package — 64-LQFP (10x10 mm)
Operating Supply Voltage — [DATA_NEEDED: Vdd range]
Operating Temperature Range — [DATA_NEEDED: temperature grade]
Integrated CAN Module — Yes (CAN 2.0)

Datasheets & Resources

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