MC9S08DV128MLH vs MC9S08DV128CLH Comparison
Detailed side-by-side comparison of MC9S08DV128MLH by NXP Semiconductors and MC9S08DV128CLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DV128MLH - 8-bit 40MHz 128KB Flash MCU | NXP | LQFP-64
MC9S08DV128MLH ✓ ActiveNXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ ActiveSpecification Comparison
| Parameter | MC9S08DV128MLH | MC9S08DV128CLH |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.10 | $4.42 |
| Core | HCS08 (8-bit, CISC, HC08-compatible with BGND) | — |
| CPU Clock Speed | 40 MHz (20 MHz bus) | — |
| Program Memory | 128 KB Flash | — |
| Supply Voltage | 2.7 V to 5.5 V | — |
| I/O Ports | 40 | — |
| Package | 64-LQFP 10x10 mm, 0.5 mm pitch | 64-LQFP (10x10 mm) |
| ADC | 24-channel, 12-bit, 2.5 µs conversion | — |
| CAN | 1x CAN 2.0A/B module (per family datasheet) | — |
| Interrupt Sources | Up to 32 | Up to 32 |
| Mounting Type | Surface Mount (LQFP) | Surface Mount |
| Package Height | 1.40 mm | — |
| Operating Temperature | [DATA_NEEDED: automotive or industrial grade] | — |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| ROM Type | Flash | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Data Bus Width | — | 8-bit |
| CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 6 KB (6K x 8) |
| Number of I/O Pins | — | 53 |
| Oscillator Type | — | External |
| Operating Supply Voltage | — | [DATA_NEEDED: Vdd range] |
| Operating Temperature Range | — | [DATA_NEEDED: temperature grade] |
| Instruction Set | — | HC08 with BGND addition |
| Integrated CAN Module | — | Yes (CAN 2.0) |
| Packaging | — | Tray |