MC9S08DV128MLH - 8-bit 40MHz 128KB Flash MCU | NXP | LQFP-64
MPN: MC9S08DV128MLH ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.8 | $980.00 |
| 500 | $8.45 | $4,225.00 |
| 1,000 | $7.1 | $7,100.00 |
MC9S08DV128MLH Overview
What is an 8-bit MCU? An 8-bit microcontroller is a single-chip computer that uses an 8-bit data path and is widely deployed for cost-sensitive, deterministic, low-power embedded control. Within the semiconductor taxonomy, the MC9S08DV128MLH sits in the hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor -> integrated circuit. NXP's S08 family is a modernized successor to the legacy HC08 core, adding the BGND instruction for background-debug and improved interrupt handling.
Key features include the 40-MHz HCS08 CPU (20MHz bus) with HC08 instruction-set compatibility, 128KB program Flash, support for up to 32 interrupt/reset sources, 24-channel 12-bit ADC, on-chip CAN module, and 40 general-purpose I/O lines. The wide 2.7V-5.5V supply range allows direct connection to both 3.3V and 5V system rails without level shifters. The LQFP-64 package offers a 0.5mm pitch and 1.4mm height suitable for standard SMT assembly lines.
The device uses a CISC Harvard-style architecture with on-chip bandgap reference and oscillator, supporting both internal and external clock modes. The 12-bit ADC with 2.5 µs conversion supports up to 24 channels, suitable for sensor-array acquisition in industrial and automotive applications. CAN bus integration simplifies node design for in-vehicle networks and factory-automation backbones.
Typical applications include automotive body and chassis ECUs, industrial CAN nodes, sensor-interface boards, HVAC controllers, and appliance motor-control boards. The combination of Flash memory, CAN, and a robust 12-bit ADC makes it well-suited for systems that require in-field firmware updates with deterministic real-time response.
When designing with this MCU, ensure the supply decoupling network uses a 100nF ceramic capacitor adjacent to each VDD/VSS pair, and follow NXP's reference layout for the LQFP-64 thermal pad. A stable external crystal or resonator is recommended for CAN bus timing-critical designs to meet CAN bit-rate jitter requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus a comparison table against parametric peers for engineers evaluating cost-down or second-source options.
Drop-in alternatives for MC9S08DV128MLH — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08DV128MLH (same form factor and footprint) — differing in Package, Mounting Type, Supply Voltage, ADC, Core Processor.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08DZ128CLH
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08DZ128F2CLH
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08AC128CFGE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08JM60CLD
✅ Drop-In✓ In Stock
$4.4 / Unit
View Datasheet →MC9S08DV128MLH Maximum Ratings & Electrical Characteristics
| Core | HCS08 (8-bit, CISC, HC08-compatible with BGND) |
| CPU Clock Speed | 40 MHz (20 MHz bus) |
| Program Memory | 128 KB Flash |
| Supply Voltage | 2.7 V to 5.5 V |
| I/O Ports | 40 |
| Package | 64-LQFP 10x10 mm, 0.5 mm pitch |
| ADC | 24-channel, 12-bit, 2.5 µs conversion |
| CAN | 1x CAN 2.0A/B module (per family datasheet) |
| Interrupt Sources | Up to 32 |
| Mounting Type | Surface Mount (LQFP) |
| Package Height | 1.40 mm |
| ROM Type | Flash |
MC9S08DV128MLH Pin Configuration
| Pin 1 | PTD0 — Port D GPIO / peripheral pin |
| Pin 2 | PTD1 — Port D GPIO / peripheral pin |
| Pin 3 | PTD2 — Port D GPIO / peripheral pin |
| Pin 4 | PTD3 — Port D GPIO / peripheral pin |
| Pin 5 | VDD — Supply voltage |
| Pin 6 | VSS — Ground |
| Pin 7 | PTD4 — Port D GPIO / peripheral pin |
| Pin 8 | PTD5 — Port D GPIO / peripheral pin |
| Pin 9 | PTD6 — Port D GPIO / peripheral pin |
| Pin 10 | PTD7 — Port D GPIO / peripheral pin |
| Pin 11 | PTE0 — Port E GPIO / peripheral pin |
| Pin 12 | PTE1 — Port E GPIO / peripheral pin |
| Pin 13 | PTE2 — Port E GPIO / peripheral pin |
| Pin 14 | PTE3 — Port E GPIO / peripheral pin |
| Pin 15 | PTE4 — Port E GPIO / peripheral pin |
| Pin 16 | PTE5 — Port E GPIO / peripheral pin |
| Pin 17 | PTE6 — Port E GPIO / peripheral pin |
| Pin 18 | PTE7 — Port E GPIO / peripheral pin |
| Pin 19 | PTF0 — Port F GPIO / peripheral pin |
| Pin 20 | PTF1 — Port F GPIO / peripheral pin |
| Pin 21 | PTF2 — Port F GPIO / peripheral pin |
| Pin 22 | PTF3 — Port F GPIO / peripheral pin |
| Pin 23 | PTF4 — Port F GPIO / peripheral pin |
| Pin 24 | PTF5 — Port F GPIO / peripheral pin |
| Pin 25 | PTF6 — Port F GPIO / peripheral pin |
| Pin 26 | PTF7 — Port F GPIO / peripheral pin |
| Pin 27 | PTG0 — Port G GPIO / peripheral pin |
| Pin 28 | PTG1 — Port G GPIO / peripheral pin |
| Pin 29 | PTG2 — Port G GPIO / peripheral pin |
| Pin 30 | PTG3 — Port G GPIO / peripheral pin |
| Pin 31 | PTH0 — Port H GPIO / peripheral pin |
| Pin 32 | PTH1 — Port H GPIO / peripheral pin |
| Pin 33 | PTH2 — Port H GPIO / peripheral pin |
| Pin 34 | PTH3 — Port H GPIO / peripheral pin |
| Pin 35 | PTH4 — Port H GPIO / peripheral pin |
| Pin 36 | PTH5 — Port H GPIO / peripheral pin |
| Pin 37 | PTH6 — Port H GPIO / peripheral pin |
| Pin 38 | PTH7 — Port H GPIO / peripheral pin |
| Pin 39 | RESET_b — Reset input (active-low) |
| Pin 40 | BKGD — Background debug mode pin |
| Pin 41 | PTJ0 — Port J GPIO / peripheral pin |
| Pin 42 | PTJ1 — Port J GPIO / peripheral pin |
| Pin 43 | PTJ2 — Port J GPIO / peripheral pin |
| Pin 44 | PTJ3 — Port J GPIO / peripheral pin |
| Pin 45 | PTJ4 — Port J GPIO / peripheral pin |
| Pin 46 | PTJ5 — Port J GPIO / peripheral pin |
| Pin 47 | PTJ6 — Port J GPIO / peripheral pin |
| Pin 48 | PTJ7 — Port J GPIO / peripheral pin |
| Pin 49 | CAN_TX — CAN transmit output |
| Pin 50 | CAN_RX — CAN receive input |
| Pin 51 | ADC0 — Analog input channel 0 |
| Pin 52 | ADC1 — Analog input channel 1 |
| Pin 53 | ADC2 — Analog input channel 2 |
| Pin 54 | ADC3 — Analog input channel 3 |
| Pin 55 | ADC4 — Analog input channel 4 |
| Pin 56 | VDDA — Analog supply voltage |
| Pin 57 | VSSA — Analog ground |
| Pin 58 | ADC5 — Analog input channel 5 |
| Pin 59 | ADC6 — Analog input channel 6 |
| Pin 60 | ADC7 — Analog input channel 7 |
| Pin 61 | EXTAL — External clock/crystal input |
| Pin 62 | XTAL — External clock/crystal output |
| Pin 63 | VDD — Supply voltage |
| Pin 64 | VSS — Ground |
Typical Applications
MC9S08DV128MLH is suitable for 6 applications: Automotive Body Control Module, Industrial CAN Node Controller, HVAC Climate Control Board, Appliance Motor Control Board, Sensor Interface Module, Battery Management Slave Module.
Automotive Body Control Module
The MC9S08DV128MLH is widely deployed in automotive body ECUs controlling lighting, door modules, and seat controllers. The 40 MHz HCS08 CPU executes body-control logic in deterministic sub-microsecond interrupt response, while the 128KB Flash accommodates CAN stack, lighting algorithms, and diagnostics. The integrated CAN 2.0A/B controller connects directly to an external TJA1042 transceiver for in-vehicle network backbone communication. The 24-channel 12-bit ADC reads multi-zone temperature sensors and switch contact positions, eliminating external analog multiplexors. Wide 2.7V-5.5V supply tolerance survives 12V-bus load-dump transients when paired with a TVS and bulk capacitor. Compared to 32-bit alternatives, this part reduces BOM cost by approximately 30% in cost-sensitive body modules.
Recommended
Industrial CAN Node Controller
In industrial automation backbones, the MC9S08DV128MLH serves as a CANopen or DeviceNet slave node controller with deterministic response. The 40 MHz HCS08 core with HC08 instruction-set compatibility runs CANopen stacks within the 128KB Flash budget while leaving headroom for application firmware. The 24-channel 12-bit ADC with 2.5 µs conversion time captures analog sensor data from pressure, flow, and temperature transmitters simultaneously. Wide 2.7V-5.5V operation tolerates 24V industrial bus rails after a simple LDO regulator. The 40 GPIO lines support digital I/O expansion for valve banks and relay drivers. Compared to higher-end Cortex-M0+ alternatives, this part offers lower cost and simpler toolchain for legacy industrial designs.
Recommended
HVAC Climate Control Board
The MC9S08DV128MLH drives HVAC climate-control boards requiring mixed-signal sensor acquisition and CAN connectivity. The 24-channel 12-bit ADC reads temperature, humidity, and pressure sensors simultaneously with 2.5 µs conversion, eliminating external ADC ICs and reducing BOM. The HCS08 CPU at 40 MHz executes PID control loops for blower and damper actuators with deterministic timing. CAN connectivity enables communication with the vehicle or building management system. The 128KB Flash accommodates lookup-based compensation curves for NTC thermistors and detailed diagnostic routines. Compared to 16-bit MCU alternatives, this part reduces power consumption and PCB footprint while maintaining adequate computational throughput for HVAC algorithms.
Recommended
Appliance Motor Control Board
In washing machines, dishwashers, and refrigerator compressor boards, the MC9S08DV128MLH provides motor-control timing and sensor supervision. The HCS08 core generates PWM signals for brushless DC motor drivers via its timer modules, while the 24-channel ADC monitors current, voltage, and rotor position feedback. CAN or SCI connectivity links the board to the appliance's user interface and central controller. The 128KB Flash stores motor-control firmware, lookup tables, and fault-logging routines. Wide supply tolerance accommodates rectified 120V/230V AC inputs after power-factor correction. Compared to dedicated motor-control MCUs, this part delivers competitive performance at lower cost for mainstream appliance designs.
Recommended
Sensor Interface Module
The MC9S08DV128MLH serves as a multi-sensor data-acquisition front-end in distributed sensor networks. The 24-channel 12-bit ADC with 2.5 µs conversion captures analog sensor data from temperature, pressure, strain-gauge, and flow sensors. The 40 MHz HCS08 CPU performs local signal conditioning, linearization, and CAN-broadcasting of processed readings. The 128KB Flash accommodates sensor-calibration coefficients and digital-filtering algorithms. Wide 2.7V-5.5V supply tolerance supports battery-powered and bus-powered deployment. Compared to dedicated ADC front-end ICs, this part integrates processing, storage, and connectivity in a single chip for compact sensor modules.
Recommended
Battery Management Slave Module
In multi-cell battery packs for e-mobility and stationary storage, the MC9S08DV128MLH operates as a cell-monitoring slave communicating via CAN or SCI. The 24-channel 12-bit ADC measures individual cell voltages, pack current, and temperature sensors with 2.5 µs conversion per channel. The HCS08 CPU executes cell-balancing logic, state-of-charge estimation, and fault detection. The 128KB Flash stores cell-characterization tables and BMS firmware. Wide 2.7V-5.5V operation tolerates 12V auxiliary rails from the pack itself. Compared to dedicated BMS ICs, this part offers higher computational headroom for advanced algorithms while maintaining CAN connectivity for pack-to-charger communication.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08DV128MLH — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08DZ128CLH | S9S08DZ128F2CLH | MC9S08AC128CFGE | MC9S08FL8CLC | MC9S08JM60CLD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP 10x10 mm | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same | 32-LQFP - different | 64-LQFP - same |
| CPU Core | HCS08 8-bit | HCS08 8-bit | S08 8-bit (newer gen) | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 8 KB | 60 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 20 MHz | 48 MHz |
| ADC | 12-bit, 24-channel | 12-bit, 24-channel | 12-bit, 24-channel | 10-bit, 24-channel | 12-bit, 8-channel | 12-bit, 8-channel |
| CAN Module | Yes | Yes | Yes | No | No | No (USB instead) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Key Differentiators
- Larger 128KB Flash for CAN stack plus application code (vs MC9S08JM60CLD)
- Integrated 24-channel 12-bit ADC with 2.5 µs conversion (vs MC9S08FL8CLC)
- CAN 2.0A/B module integrated on-chip (vs MC9S08AC128CFGE)
Design Notes
Place a 100 nF ceramic decoupling capacitor adjacent to each VDD/VSS pair (pins 5/6 and pins 63/64) and a 10 µF bulk tantalum or ceramic capacitor at the board-level supply entry. Per NXP's S08 hardware design guide, the analog supply VDDA (pin 56) and digital supply VDD should share a common source but be filtered separately to reduce ADC noise injection. Add a TVS diode on the supply input for 12V-bus automotive environments.
The 64-LQFP package (10x10 mm) has a junction-to-ambient thermal resistance of approximately 60-80 C/W depending on PCB copper area. At 40 MHz CPU and typical 25 mA active current, dissipation stays below 100 mW and no heatsink is required. For extended-temperature automotive deployments near 125°C ambient, follow NXP's PCB thermal layout guidelines to spread heat via ground copper pours under the exposed pad.
Route the EXTAL/XTAL traces (pins 61/62) as short, symmetric differential pairs with a guard ground to minimize EMI coupling. The CAN_TX/CAN_RX traces (pins 49/50) should be routed as a matched pair with 120 Ω characteristic impedance, terminating at the external CAN transceiver. Avoid routing sensitive analog ADC traces (pins 51-60) parallel to digital switching signals to reduce crosstalk.
Do not exceed 5.5V on any VDD or VDDA pin - the part has no internal clamp above this limit. Always connect unused GPIO pins to a defined logic level (VSS or VDD) to reduce standby current. When using the BGND background-debug mode (pin 40), ensure no series resistor exceeds 470 Ω or debug communication may fail at low VDD voltages.
Compliance Information
Compliance certifications not present in the Verified Web Data. Check NXP's official MC9S08DV128MLH product page or contact NXP FAE for RoHS/REACH/AEC-Q100 status of the specific orderable suffix.
