MC9S08DV128MLH vs MC9S08DV128CLH Vergleich
Detaillierter Direktvergleich von MC9S08DV128MLH von NXP Semiconductors und MC9S08DV128CLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08DV128MLH - 8-bit 40MHz 128KB Flash MCU | NXP | LQFP-64
MC9S08DV128MLH ✓ AktivNXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08DV128MLH | MC9S08DV128CLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,10 | $4,42 |
| Core | HCS08 (8-bit, CISC, HC08-compatible with BGND) | — |
| CPU Clock Speed | 40 MHz (20 MHz bus) | — |
| Program Memory | 128 KB Flash | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| I/O Ports | 40 | — |
| Gehäuse | 64-LQFP 10x10 mm, 0.5 mm pitch | 64-LQFP (10x10 mm) |
| ADC | 24-channel, 12-bit, 2.5 µs conversion | — |
| CAN | 1x CAN 2.0A/B module (per family datasheet) | — |
| Interrupt Sources | Up to 32 | Up to 32 |
| Montageart | Surface Mount (LQFP) | Surface Mount |
| Package Height | 1.40 mm | — |
| Betriebstemperatur | [DATA_NEEDED: automotive or industrial grade] | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| ROM Type | Flash | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Datenbusbreite | — | 8-bit |
| CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 6 KB (6K x 8) |
| Number of I/O Pins | — | 53 |
| Oscillator Type | — | External |
| Betriebsversorgungsspannung | — | [DATA_NEEDED: Vdd range] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: temperature grade] |
| Instruction Set | — | HC08 with BGND addition |
| Integrated CAN Module | — | Yes (CAN 2.0) |
| Packaging | — | Tray |