MC9S12D64VFUE vs MC9S12B64MFUE Comparison

Detailed side-by-side comparison of MC9S12D64VFUE by NXP Semiconductors and MC9S12B64MFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12D64VFUE MC9S12D64VFUE - 16-bit HCS12 MCU 64KB Flash 25MHz | NXP

MC9S12D64VFUE - 16-bit HCS12 MCU 64KB Flash 25MHz | NXP

MC9S12D64VFUE ✓ Active
NXP Semiconductors
MC9S12B64MFUE MC9S12B64MFUE - 16-Bit 25MHz HCS12 MCU 64KB Flash | NXP

MC9S12B64MFUE - 16-Bit 25MHz HCS12 MCU 64KB Flash | NXP

MC9S12B64MFUE ✓ Active

Specification Comparison

Parameter MC9S12D64VFUE MC9S12B64MFUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.85 $9.10
Core Processor HCS12 —
Core Architecture 16-bit CISC —
Core Size 16-bit —
Maximum Clock Frequency 25 MHz 25 MHz
Flash Memory 64KB (64K x 8) —
RAM Size [DATA_NEEDED: SRAM size] 2 KB
EEPROM Size [DATA_NEEDED: EEPROM size] —
Supply Voltage 2.5V / 5V 5 V
Package 80-QFP (14x14 mm) 80-QFP (14 x 14 mm)
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] —
Peripherals [DATA_NEEDED: peripheral list (CAN, SCI, SPI, ADC, PWM)] —
Connectivity [DATA_NEEDED: connectivity interfaces] —
Program Memory Type FLASH —
Supplier Device Package 80-QFP —
Base Product Number MC9S12D64 —
Family Series S12D (MC9S12D-Family) —
Packaging Tray —
Application Target Automotive multiplexing —
Series — HCS12
Core — HCS12 (CISC)
Data Bus Width — 16-bit
Program Memory Size (Flash) — 64 KB (64K x 8)
Pin Count — 80
Communication Interfaces — CAN, SCI (UART), SPI
A/D Channels — [DATA_NEEDED: A/D channel count]
A/D Resolution — [DATA_NEEDED: A/D resolution]
Timers — [DATA_NEEDED: timer module count]
PWM Channels — [DATA_NEEDED: PWM channel count]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Debug Interface — BDM (Background Debug Mode)
RoHS Status — RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code)
Lead-Free / Lead Content — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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