MC9S12D64VFUE vs MC9S12B64MFUE Vergleich
Detaillierter Direktvergleich von MC9S12D64VFUE von NXP Semiconductors und MC9S12B64MFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12D64VFUE | MC9S12B64MFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,85 | $9,10 |
| Core Processor | HCS12 | — |
| Core Architecture | 16-bit CISC | — |
| Core Size | 16-bit | — |
| Maximale Taktfrequenz | 25 MHz | 25 MHz |
| Flash Memory | 64KB (64K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | 2 KB |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Versorgungsspannung | 2.5V / 5V | 5 V |
| Gehäuse | 80-QFP (14x14 mm) | 80-QFP (14 x 14 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Peripherals | [DATA_NEEDED: peripheral list (CAN, SCI, SPI, ADC, PWM)] | — |
| Connectivity | [DATA_NEEDED: connectivity interfaces] | — |
| Program Memory Type | FLASH | — |
| Supplier Device Package | 80-QFP | — |
| Base Product Number | MC9S12D64 | — |
| Family Series | S12D (MC9S12D-Family) | — |
| Packaging | Tray | — |
| Application Target | Automotive multiplexing | — |
| Series | — | HCS12 |
| Core | — | HCS12 (CISC) |
| Datenbusbreite | — | 16-bit |
| Program Memory Size (Flash) | — | 64 KB (64K x 8) |
| Pin-Anzahl | — | 80 |
| Communication Interfaces | — | CAN, SCI (UART), SPI |
| A/D Channels | — | [DATA_NEEDED: A/D channel count] |
| A/D Resolution | — | [DATA_NEEDED: A/D resolution] |
| Timers | — | [DATA_NEEDED: timer module count] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Debug Interface | — | BDM (Background Debug Mode) |
| RoHS-Status | — | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) |
| Lead-Free / Lead Content | — | [DATA_NEEDED: lead-free status] |