MC9S12D64VFUE vs MC9S12B64MFUE Comparación
Comparación detallada lado a lado de MC9S12D64VFUE por NXP Semiconductors y MC9S12B64MFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12D64VFUE | MC9S12B64MFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,85 | $9,10 |
| Core Processor | HCS12 | — |
| Core Architecture | 16-bit CISC | — |
| Core Size | 16-bit | — |
| Frecuencia de reloj máxima | 25 MHz | 25 MHz |
| Flash Memory | 64KB (64K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | 2 KB |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Tensión de alimentación | 2.5V / 5V | 5 V |
| Encapsulado | 80-QFP (14x14 mm) | 80-QFP (14 x 14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Peripherals | [DATA_NEEDED: peripheral list (CAN, SCI, SPI, ADC, PWM)] | — |
| Connectivity | [DATA_NEEDED: connectivity interfaces] | — |
| Program Memory Type | FLASH | — |
| Supplier Device Package | 80-QFP | — |
| Base Product Number | MC9S12D64 | — |
| Family Series | S12D (MC9S12D-Family) | — |
| Packaging | Tray | — |
| Application Target | Automotive multiplexing | — |
| Series | — | HCS12 |
| Core | — | HCS12 (CISC) |
| Ancho del bus de datos | — | 16-bit |
| Program Memory Size (Flash) | — | 64 KB (64K x 8) |
| Recuento de pines | — | 80 |
| Communication Interfaces | — | CAN, SCI (UART), SPI |
| A/D Channels | — | [DATA_NEEDED: A/D channel count] |
| A/D Resolution | — | [DATA_NEEDED: A/D resolution] |
| Timers | — | [DATA_NEEDED: timer module count] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Debug Interface | — | BDM (Background Debug Mode) |
| Estado RoHS | — | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) |
| Lead-Free / Lead Content | — | [DATA_NEEDED: lead-free status] |