MC9S12DG256CVPV vs MC9S12DG256BCPV Comparison

Detailed side-by-side comparison of MC9S12DG256CVPV by NXP Semiconductors and MC9S12DG256BCPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DG256BCPV MC9S12DG256BCPV - 16-Bit HCS12 MCU, 256KB Flash | NXP

MC9S12DG256BCPV - 16-Bit HCS12 MCU, 256KB Flash | NXP

MC9S12DG256BCPV Obsolete

Specification Comparison

Parameter MC9S12DG256CVPV MC9S12DG256BCPV
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $12.40 $22.40
Core Architecture HCS12 (16-bit CISC) CISC
Core Frequency 25 MHz —
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
Data Bus Width 16-bit —
Package 112-LQFP (20x20 mm) —
Mounting Type Surface Mount Surface Mount
Supply Voltage 2.97 V to 5.5 V 2.5 V / 5 V
Operating Temperature -40C to +85C (industrial) [DATA_NEEDED: operating temperature range]
I/O Pins 91 —
ADC 2x 8-channel, 10-bit —
PWM Channels 8 —
Capture Timer 8-channel enhanced —
Communication Interfaces 2x SCI, CAN, SPI, I²C —
MSL Level 3 (168 hours) —
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Core Processor — HCS12
Core Size — 16-bit
Maximum Clock Speed — 25 MHz
Program Memory Size — 256 KB (256K x 8) Flash
Program Memory Type — Flash
RAM Size — 12 KB
EEPROM Size — 4 KB x 8
Number of I/O — 91
Oscillator Type — Internal
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT
Package / Case — 112-LQFP (20 x 20 mm)
Packaging — Tray

Datasheets & Resources

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