MC9S12DT256CMPV vs MC9S12XDT512MAA Comparison
Detailed side-by-side comparison of MC9S12DT256CMPV by NXP Semiconductors and MC9S12XDT512MAA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ Active
Specification Comparison
| Parameter | MC9S12DT256CMPV | MC9S12XDT512MAA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.50 | $0.00 |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Package | LQFP-112 | 80-QFP (14x14 mm), Square, Gull Wing |
| Pin Count | 112 | — |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | — |
| PWM Channels | 8 channels | — |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Mounting Type | Surface Mount (LQFP, gull-wing) | Surface Mount |
| RoHS Status | Compliant (per NXP product page) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Supply Voltage | — | [DATA_NEEDED: supply voltage range] |
| Operating Temperature | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Halogen Free | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |