MC9S12DT256CMPV vs MC9S12XDT512MAA 对比

详细并排对比 MC9S12DT256CMPV 出自 NXP Semiconductors 和 MC9S12XDT512MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ 量产中
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

规格对比

参数 MC9S12DT256CMPV MC9S12XDT512MAA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $11.50 $0.00
Core Architecture HCS12 (S12) 16-bit CISC —
Bus Frequency Up to 50 MHz —
Program Flash 256 KB —
RAM 12 KB —
EEPROM 4 KB —
封装 LQFP-112 80-QFP (14x14 mm), Square, Gull Wing
引脚数量 112 —
Operating Voltage 5.0 V (4.5 V to 5.5 V) —
Temperature Grade Automotive (-40C to +125C) —
ADC 2 x 8-channel 10-bit —
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel (ECT) —
SCI (UART) Interfaces 2 —
SPI Interfaces 2 —
CAN Modules 1 x msCAN (CAN 2.0A/B) —
GPIO (Approx.) 20 discrete digital I/O lines —
Debug Interface Background Debug Mode (BDM) —
安装类型 Surface Mount (LQFP, gull-wing) Surface Mount
RoHS 状态 Compliant (per NXP product page) —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
电源电压 — [DATA_NEEDED: supply voltage range]
工作温度 — -40C to +125C (TA)
Packaging Method — Tray
无卤 — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

数据手册与资源

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