MC9S12DT256CMPV vs MC9S12XDT512MAA Vergleich
Detaillierter Direktvergleich von MC9S12DT256CMPV von NXP Semiconductors und MC9S12XDT512MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ Aktiv
Spezifikationsvergleich
| Parameter | MC9S12DT256CMPV | MC9S12XDT512MAA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,50 | $0,00 |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Gehäuse | LQFP-112 | 80-QFP (14x14 mm), Square, Gull Wing |
| Pin-Anzahl | 112 | — |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | — |
| PWM Channels | 8 channels | — |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Montageart | Surface Mount (LQFP, gull-wing) | Surface Mount |
| RoHS-Status | Compliant (per NXP product page) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Halogenfrei | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |