MC9S12XA256CAL vs MC9S12DG256CCPV Comparison
Detailed side-by-side comparison of MC9S12XA256CAL by NXP Semiconductors and MC9S12DG256CCPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndSpecification Comparison
| Parameter | MC9S12XA256CAL | MC9S12DG256CCPV |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $26.91 | $18.20 |
| Core Processor | HCS12X (S12XA), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | [DATA_NEEDED: exact RAM size] | 12 KB |
| Supply Voltage Range | 2.35 V to 5.5 V | 2.97 V to 5.5 V (single 5 V supply) |
| I/O Count | 59 | — |
| ADC Resolution | 10 bit | — |
| Data Bus Width | 16 bit | — |
| Package | 112-LQFP (20x20 mm) | — |
| Mounting Type | Surface Mount (SMD/SMT, gull-wing) | Surface Mount |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| Lifecycle Status | NRND (Not Recommended for New Designs) per NXP | — |
| Architecture Family | S12X / HCS12X | — |
| Program Memory Type | FLASH | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance detail] | Compliant |
| Pin Count | 112 | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Operating Temperature Range | — | -40 °C to +85 °C (industrial) |
| Package / Case | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| PWM Channels | — | 8 channels |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |
| MSL Level | — | 3 (168 hours, JEDEC J-STD-020) |