MC9S12XDP512MAG vs MC9S12XDT512MAL Comparison

Detailed side-by-side comparison of MC9S12XDP512MAG by NXP Semiconductors and MC9S12XDT512MAL by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12XDP512MAG MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG Nrnd

Specification Comparison

Parameter MC9S12XDP512MAG MC9S12XDT512MAL
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $14.20
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit 16-bit
Maximum Clock Frequency 80 MHz —
Flash Memory Size 512 KB (512K x 8) —
Supply Voltage 2.5 V / 5 V 2.5 V / 5 V
Package 144-LQFP (20x20 mm) —
Mounting Type Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Shape Square (LFQFP) —
ADC Resolution 10-bit —
Temperature Grade Automotive —
Qualification AEC-Q100 —
Instruction Set Compatibility Upward compatible with HCS12 —
External Bus Interface Yes (144-pin LQFP option) —
Target Application Domain Automotive multiplexing —
Lifecycle Status NRND (Not Recommended for New Designs) —
Core Architecture — CISC
Maximum CPU Speed — 80 MHz
Program Memory — 512 KB Flash
RAM — 20 KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — [DATA_NEEDED: number of I/O pins]
ADC — 8/10-bit (channels [DATA_NEEDED])
Package Type — 112-LQFP (20x20 mm)
Operating Temperature — -40C to +125C
Series — MC9S12 / S12XD
Process Technology — TSMC3 (automotive qualified)
Boundary-Scan Debug — BDM + JTAG/Nexus
RoHS Status — [DATA_NEEDED: rohs status]
Lifecycle — NRND (Not Recommended for New Designs)

Datasheets & Resources

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