MC9S12XDP512MAG vs MC9S12XDT512MAL 对比

详细并排对比 MC9S12XDP512MAG 出自 NXP Semiconductors 和 MC9S12XDT512MAL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XDP512MAG MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG Nrnd

规格对比

参数 MC9S12XDP512MAG MC9S12XDT512MAL
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $0.00 $14.20
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit 16-bit
最大时钟频率 80 MHz —
Flash Memory Size 512 KB (512K x 8) —
电源电压 2.5 V / 5 V 2.5 V / 5 V
封装 144-LQFP (20x20 mm) —
安装类型 Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Shape Square (LFQFP) —
ADC Resolution 10-bit —
Temperature Grade Automotive —
Qualification AEC-Q100 —
Instruction Set Compatibility Upward compatible with HCS12 —
External Bus Interface Yes (144-pin LQFP option) —
Target Application Domain Automotive multiplexing —
生命周期状态 NRND (Not Recommended for New Designs) —
Core Architecture — CISC
Maximum CPU Speed — 80 MHz
Program Memory — 512 KB Flash
RAM — 20 KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — [DATA_NEEDED: number of I/O pins]
ADC — 8/10-bit (channels [DATA_NEEDED])
Package Type — 112-LQFP (20x20 mm)
工作温度 — -40C to +125C
Series — MC9S12 / S12XD
Process Technology — TSMC3 (automotive qualified)
Boundary-Scan Debug — BDM + JTAG/Nexus
RoHS 状态 — [DATA_NEEDED: rohs status]
Lifecycle — NRND (Not Recommended for New Designs)

数据手册与资源

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