MCF53012CQT240 vs MPC5121VY400 Comparison

Detailed side-by-side comparison of MCF53012CQT240 by NXP Semiconductors and MPC5121VY400 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF53012CQT240 MCF53012CQT240 - 32-Bit 240MHz ROMless MCU | NXP

MCF53012CQT240 - 32-Bit 240MHz ROMless MCU | NXP

MCF53012CQT240 Obsolete
NXP Semiconductors
MPC5121VY400 MPC5121VY400 - 32-Bit 400MHz ROMless MCU | NXP | Industrial

MPC5121VY400 - 32-Bit 400MHz ROMless MCU | NXP | Industrial

MPC5121VY400 Unknown

Specification Comparison

Parameter MCF53012CQT240 MPC5121VY400
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete Unknown
Stock Status In Stock In Stock
Unit Price (USD) $16.74 $0.00
Core Processor ColdFire V3 —
Core Size 32-bit —
Maximum Clock Speed 240 MHz —
Product Type ROMless Microcontroller 32-bit ROMless microcontroller
Series MCF5301x —
Program Memory ROMless —
Package 208-pin TQFP (28 mm x 28 mm) —
Terminal Count 208 —
Number of I/O 61 —
Connectivity EBI/EMI, Ethernet, I2C, memory card, SPI, SSI, UART/USART, USB OTG —
Peripherals DMA, PWM, WDT —
Temperature Grade Industrial —
Lifecycle Status Obsolete —
Mounting Type Surface Mount Surface-mount BGA
Package Family TQFP —
Manufacturer NXP USA Inc. NXP Semiconductors
Data Bus EBI/EMI —
Network Interface Ethernet —
USB Interface USB OTG —
Serial Interfaces I2C, SPI, SSI, UART/USART —
Removable Media Interface Memory card —
Supply Voltage [DATA_NEEDED: supply voltage] [DATA_NEEDED: operating supply voltage]
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
External Memory Details [DATA_NEEDED: external memory interface details] —
Detailed Pinout [DATA_NEEDED: complete pinout] —
Processor Architecture — 32-bit
Processor Frequency — 400 MHz
Product Family — e300 MPC51xx Qorivva
Memory Configuration — ROMless
Package Type — 516-TEPBGA
Package Dimensions — 27 x 27 mm
Ball Count — 516 balls
Listed Manufacturer Description — Freescale Semiconductor
Application Class — Industrial embedded control
Internal Program Memory — [DATA_NEEDED: internal program memory size]
Internal Data Memory — [DATA_NEEDED: internal data memory size]
Operating Temperature — [DATA_NEEDED: operating temperature range]
External Memory Support — [DATA_NEEDED: external memory interface specifications]
Peripheral Interfaces — [DATA_NEEDED: peripheral interface list]
RoHS Status — unknown
REACH Status — unknown

Datasheets & Resources

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