MCF53012CQT240 vs MPC5121VY400 Comparaison
Comparaison détaillée côte à côte de MCF53012CQT240 par NXP Semiconductors et MPC5121VY400 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MCF53012CQT240 | MPC5121VY400 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Unknown |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $16,74 | $0,00 |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Product Type | ROMless Microcontroller | 32-bit ROMless microcontroller |
| Series | MCF5301x | — |
| Program Memory | ROMless | — |
| Boîtier | 208-pin TQFP (28 mm x 28 mm) | — |
| Terminal Count | 208 | — |
| Number of I/O | 61 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, memory card, SPI, SSI, UART/USART, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Temperature Grade | Industrial | — |
| Statut du cycle de vie | Obsolete | — |
| Type de montage | Surface Mount | Surface-mount BGA |
| Package Family | TQFP | — |
| Manufacturer | NXP USA Inc. | NXP Semiconductors |
| Data Bus | EBI/EMI | — |
| Network Interface | Ethernet | — |
| USB Interface | USB OTG | — |
| Serial Interfaces | I2C, SPI, SSI, UART/USART | — |
| Removable Media Interface | Memory card | — |
| Tension d'alimentation | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: operating supply voltage] |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| External Memory Details | [DATA_NEEDED: external memory interface details] | — |
| Detailed Pinout | [DATA_NEEDED: complete pinout] | — |
| Processor Architecture | — | 32-bit |
| Processor Frequency | — | 400 MHz |
| Product Family | — | e300 MPC51xx Qorivva |
| Memory Configuration | — | ROMless |
| Package Type | — | 516-TEPBGA |
| Package Dimensions | — | 27 x 27 mm |
| Ball Count | — | 516 balls |
| Listed Manufacturer Description | — | Freescale Semiconductor |
| Application Class | — | Industrial embedded control |
| Internal Program Memory | — | [DATA_NEEDED: internal program memory size] |
| Internal Data Memory | — | [DATA_NEEDED: internal data memory size] |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| External Memory Support | — | [DATA_NEEDED: external memory interface specifications] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interface list] |
| Statut RoHS | — | unknown |
| REACH Status | — | unknown |