MCF53012CQT240 vs MPC5121VY400 Vergleich

Detaillierter Direktvergleich von MCF53012CQT240 von NXP Semiconductors und MPC5121VY400 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF53012CQT240 MCF53012CQT240 - 32-Bit 240MHz ROMless MCU | NXP

MCF53012CQT240 - 32-Bit 240MHz ROMless MCU | NXP

MCF53012CQT240 Obsolete
NXP Semiconductors
MPC5121VY400 MPC5121VY400 - 32-Bit 400MHz ROMless MCU | NXP | Industrial

MPC5121VY400 - 32-Bit 400MHz ROMless MCU | NXP | Industrial

MPC5121VY400 Unknown

Spezifikationsvergleich

Parameter MCF53012CQT240 MPC5121VY400
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $16,74 $0,00
Core Processor ColdFire V3 —
Core Size 32-bit —
Maximum Clock Speed 240 MHz —
Product Type ROMless Microcontroller 32-bit ROMless microcontroller
Series MCF5301x —
Program Memory ROMless —
Gehäuse 208-pin TQFP (28 mm x 28 mm) —
Terminal Count 208 —
Number of I/O 61 —
Connectivity EBI/EMI, Ethernet, I2C, memory card, SPI, SSI, UART/USART, USB OTG —
Peripherals DMA, PWM, WDT —
Temperature Grade Industrial —
Lebenszyklusstatus Obsolete —
Montageart Surface Mount Surface-mount BGA
Package Family TQFP —
Manufacturer NXP USA Inc. NXP Semiconductors
Data Bus EBI/EMI —
Network Interface Ethernet —
USB Interface USB OTG —
Serial Interfaces I2C, SPI, SSI, UART/USART —
Removable Media Interface Memory card —
Versorgungsspannung [DATA_NEEDED: supply voltage] [DATA_NEEDED: operating supply voltage]
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
External Memory Details [DATA_NEEDED: external memory interface details] —
Detailed Pinout [DATA_NEEDED: complete pinout] —
Processor Architecture — 32-bit
Processor Frequency — 400 MHz
Product Family — e300 MPC51xx Qorivva
Memory Configuration — ROMless
Package Type — 516-TEPBGA
Package Dimensions — 27 x 27 mm
Ball Count — 516 balls
Listed Manufacturer Description — Freescale Semiconductor
Application Class — Industrial embedded control
Internal Program Memory — [DATA_NEEDED: internal program memory size]
Internal Data Memory — [DATA_NEEDED: internal data memory size]
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
External Memory Support — [DATA_NEEDED: external memory interface specifications]
Peripheral Interfaces — [DATA_NEEDED: peripheral interface list]
RoHS-Status — unknown
REACH Status — unknown

Datenblätter & Ressourcen

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