MCF53012CQT240 vs MPC5121VY400 Comparación
Comparación detallada lado a lado de MCF53012CQT240 por NXP Semiconductors y MPC5121VY400 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF53012CQT240 | MPC5121VY400 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,74 | $0,00 |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Product Type | ROMless Microcontroller | 32-bit ROMless microcontroller |
| Series | MCF5301x | — |
| Program Memory | ROMless | — |
| Encapsulado | 208-pin TQFP (28 mm x 28 mm) | — |
| Terminal Count | 208 | — |
| Number of I/O | 61 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, memory card, SPI, SSI, UART/USART, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Temperature Grade | Industrial | — |
| Estado del ciclo de vida | Obsolete | — |
| Tipo de montaje | Surface Mount | Surface-mount BGA |
| Package Family | TQFP | — |
| Manufacturer | NXP USA Inc. | NXP Semiconductors |
| Data Bus | EBI/EMI | — |
| Network Interface | Ethernet | — |
| USB Interface | USB OTG | — |
| Serial Interfaces | I2C, SPI, SSI, UART/USART | — |
| Removable Media Interface | Memory card | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: operating supply voltage] |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| External Memory Details | [DATA_NEEDED: external memory interface details] | — |
| Detailed Pinout | [DATA_NEEDED: complete pinout] | — |
| Processor Architecture | — | 32-bit |
| Processor Frequency | — | 400 MHz |
| Product Family | — | e300 MPC51xx Qorivva |
| Memory Configuration | — | ROMless |
| Package Type | — | 516-TEPBGA |
| Package Dimensions | — | 27 x 27 mm |
| Ball Count | — | 516 balls |
| Listed Manufacturer Description | — | Freescale Semiconductor |
| Application Class | — | Industrial embedded control |
| Internal Program Memory | — | [DATA_NEEDED: internal program memory size] |
| Internal Data Memory | — | [DATA_NEEDED: internal data memory size] |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| External Memory Support | — | [DATA_NEEDED: external memory interface specifications] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interface list] |
| Estado RoHS | — | unknown |
| REACH Status | — | unknown |