MCIMX357DJQ5C vs MCIMX351AJQ5C Comparison
Detailed side-by-side comparison of MCIMX357DJQ5C by NXP Semiconductors and MCIMX351AJQ5C by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCIMX357DJQ5C - i.MX35 ARM1136 MPU 532MHz MAPBGA-400 | NXP
MCIMX357DJQ5C ⚠ Last Time BuyNXP Semiconductors
MCIMX351AJQ5C - i.MX35 ARM1136 MPU, 532MHz, 400-LFBGA | NXP
MCIMX351AJQ5C ⚠ Last Time BuySpecification Comparison
| Parameter | MCIMX357DJQ5C | MCIMX351AJQ5C |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $23.40 | $31.75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | i.MX35 | — |
| Core Processor | ARM1136JF-S | — |
| Number of Cores | 1 | 1 |
| Data Bus Width | 32-bit | 32-bit |
| Speed | 532 MHz | — |
| Operating Supply Voltage | 1.22 V to 1.47 V (core) | [DATA_NEEDED: core/IO supply voltages] |
| Package | 400-LFBGA / MAPBGA-400 (17 mm x 17 mm, 0.8 mm pitch) | — |
| Mounting Type | Surface Mount | Surface Mount, MAPBGA |
| Graphics Accelerator | OpenVG 1.1 hardware accelerator | — |
| Memory Type Supported | DDR2 (external) | — |
| Operating Temperature Range | -40C to +85C (industrial) | [DATA_NEEDED: automotive grade temperature range] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free | Yes | — |
| MSL Level | 3 | — |
| Product Family | — | i.MX35 |
| Core Architecture | — | ARM1136JF-S (ARM11) |
| Maximum Core Frequency | — | 532 MHz |
| L2 Cache Size | — | 128 KB (128K x 8 per distributor listing) |
| Number of I/O Lines | — | 96 |
| Program Memory Type | — | ROMless (external) |
| Package / Case | — | 400-LFBGA (17 mm x 17 mm, 0.8 mm pitch) |
| Oscillator Type | — | External |
| Process Technology | — | 90 nm CMOS |
| Packaging | — | Tray |
| Market | — | Automotive |
| Lifecycle | — | End of Life / Last Time Buy (per NXP product page) |