MCIMX357DJQ5C vs MCIMX351AJQ5C Vergleich
Detaillierter Direktvergleich von MCIMX357DJQ5C von NXP Semiconductors und MCIMX351AJQ5C von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCIMX357DJQ5C - i.MX35 ARM1136 MPU 532MHz MAPBGA-400 | NXP
MCIMX357DJQ5C ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MCIMX351AJQ5C - i.MX35 ARM1136 MPU, 532MHz, 400-LFBGA | NXP
MCIMX351AJQ5C ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MCIMX357DJQ5C | MCIMX351AJQ5C |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,40 | $31,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | i.MX35 | — |
| Core Processor | ARM1136JF-S | — |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32-bit | 32-bit |
| Speed | 532 MHz | — |
| Betriebsversorgungsspannung | 1.22 V to 1.47 V (core) | [DATA_NEEDED: core/IO supply voltages] |
| Gehäuse | 400-LFBGA / MAPBGA-400 (17 mm x 17 mm, 0.8 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount, MAPBGA |
| Graphics Accelerator | OpenVG 1.1 hardware accelerator | — |
| Memory Type Supported | DDR2 (external) | — |
| Betriebstemperaturbereich | -40C to +85C (industrial) | [DATA_NEEDED: automotive grade temperature range] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free | Yes | — |
| MSL-Level | 3 | — |
| Product Family | — | i.MX35 |
| Core Architecture | — | ARM1136JF-S (ARM11) |
| Maximum Core Frequency | — | 532 MHz |
| L2 Cache Size | — | 128 KB (128K x 8 per distributor listing) |
| Number of I/O Lines | — | 96 |
| Program Memory Type | — | ROMless (external) |
| Gehäuse / Bauform | — | 400-LFBGA (17 mm x 17 mm, 0.8 mm pitch) |
| Oscillator Type | — | External |
| Process Technology | — | 90 nm CMOS |
| Packaging | — | Tray |
| Market | — | Automotive |
| Lifecycle | — | End of Life / Last Time Buy (per NXP product page) |