MPC603RRX266LC vs MPC603RVG300LC Comparison

Detailed side-by-side comparison of MPC603RRX266LC by NXP Semiconductors and MPC603RVG300LC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC603RRX266LC MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC Obsolete
NXP Semiconductors
MPC603RVG300LC MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC Nrnd

Specification Comparison

Parameter MPC603RRX266LC MPC603RVG300LC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete NRND
Core Processor PowerPC 603e —
Number of Cores 1 —
Data Bus Width 32-bit —
Address Bus Width 32-bit —
Maximum Clock Frequency 266 MHz —
Core Voltage 2.5 V 2.5 V
I/O Voltage 3.3 V 3.3 V
Process Technology 0.29 micron CMOS 0.29 um CMOS
Package / Case 255-BCBGA, FCCBGA (21x21 mm) —
Mounting Type Surface Mount Surface Mount (BGA)
Packaging Tray —
Lead Free Status Contains Lead Lead Free
RoHS Status Non-Compliant —
Operating Temperature Industrial grade —
Series MPC6xx —
Processor Type — MPC603e PowerPC
Core Architecture — PowerPC RISC, 32-bit (64-bit data bus)
Core Count — 1
Operating Frequency — 300 MHz
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
External Data Bus — 64-bit
Package — 255-FCCBGA (21x21 mm) with exposed pad
Packaging Media — Tray
Operating Temperature Range — [DATA_NEEDED: operating temperature range]

Datasheets & Resources

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