MPC603RRX266LC vs MPC603RVG300LC 对比

详细并排对比 MPC603RRX266LC 出自 NXP Semiconductors 和 MPC603RVG300LC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC603RRX266LC MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC Obsolete
NXP Semiconductors
MPC603RVG300LC MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC Nrnd

规格对比

参数 MPC603RRX266LC MPC603RVG300LC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 Obsolete 不推荐新设计
Core Processor PowerPC 603e —
Number of Cores 1 —
数据总线宽度 32-bit —
Address Bus Width 32-bit —
最大时钟频率 266 MHz —
Core Voltage 2.5 V 2.5 V
I/O Voltage 3.3 V 3.3 V
Process Technology 0.29 micron CMOS 0.29 um CMOS
封装 / 外壳 255-BCBGA, FCCBGA (21x21 mm) —
安装类型 Surface Mount Surface Mount (BGA)
Packaging Tray —
Lead Free Status Contains Lead Lead Free
RoHS 状态 Non-Compliant —
工作温度 Industrial grade —
Series MPC6xx —
Processor Type — MPC603e PowerPC
Core Architecture — PowerPC RISC, 32-bit (64-bit data bus)
Core Count — 1
Operating Frequency — 300 MHz
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
External Data Bus — 64-bit
封装 — 255-FCCBGA (21x21 mm) with exposed pad
Packaging Media — Tray
工作温度范围 — [DATA_NEEDED: operating temperature range]

数据手册与资源

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