MPC603RVG300LC vs MPC603RRX266LC Comparison

Detailed side-by-side comparison of MPC603RVG300LC by NXP Semiconductors and MPC603RRX266LC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC603RVG300LC MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC Nrnd
NXP Semiconductors
MPC603RRX266LC MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP

MPC603RRX266LC Obsolete

Specification Comparison

Parameter MPC603RVG300LC MPC603RRX266LC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Processor Type MPC603e PowerPC —
Core Architecture PowerPC RISC, 32-bit (64-bit data bus) —
Core Count 1 —
Operating Frequency 300 MHz —
Core Voltage 2.5 V 2.5 V
I/O Voltage 3.3 V 3.3 V
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
External Data Bus 64-bit —
Process Technology 0.29 um CMOS 0.29 micron CMOS
Package 255-FCCBGA (21x21 mm) with exposed pad —
Mounting Type Surface Mount (BGA) Surface Mount
Packaging Media Tray —
Lead Free Status Lead Free Contains Lead
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Core Processor — PowerPC 603e
Number of Cores — 1
Data Bus Width — 32-bit
Address Bus Width — 32-bit
Maximum Clock Frequency — 266 MHz
Package / Case — 255-BCBGA, FCCBGA (21x21 mm)
Packaging — Tray
RoHS Status — Non-Compliant
Operating Temperature — Industrial grade
Series — MPC6xx

Datasheets & Resources

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