MPC603RVG300LC vs MPC603RRX266LC Vergleich
Detaillierter Direktvergleich von MPC603RVG300LC von NXP Semiconductors und MPC603RRX266LC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP
MPC603RRX266LC ObsoleteSpezifikationsvergleich
| Parameter | MPC603RVG300LC | MPC603RRX266LC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Processor Type | MPC603e PowerPC | — |
| Core Architecture | PowerPC RISC, 32-bit (64-bit data bus) | — |
| Core Count | 1 | — |
| Operating Frequency | 300 MHz | — |
| Core Voltage | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| External Data Bus | 64-bit | — |
| Process Technology | 0.29 um CMOS | 0.29 micron CMOS |
| Gehäuse | 255-FCCBGA (21x21 mm) with exposed pad | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Packaging Media | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Core Processor | — | PowerPC 603e |
| Number of Cores | — | 1 |
| Datenbusbreite | — | 32-bit |
| Address Bus Width | — | 32-bit |
| Maximale Taktfrequenz | — | 266 MHz |
| Gehäuse / Bauform | — | 255-BCBGA, FCCBGA (21x21 mm) |
| Packaging | — | Tray |
| RoHS-Status | — | Non-Compliant |
| Betriebstemperatur | — | Industrial grade |
| Series | — | MPC6xx |