MPC8245LZU266D vs MPC8255ACVVMHBB Comparison
Detailed side-by-side comparison of MPC8245LZU266D by NXP Semiconductors and MPC8255ACVVMHBB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ ActiveSpecification Comparison
| Parameter | MPC8245LZU266D | MPC8255ACVVMHBB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | — |
| Part Status | Active | — |
| Core Processor | PowerPC 603e | — |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | — |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| Supply Voltage | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| Operating Temperature | 0 C to +105 C (commercial) | — |
| Package | 352-TBGA (35 mm x 35 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount | — |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| RoHS Status | [DATA_NEEDED: confirm per lot] | Compliant |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Part Family | — | PowerQUICC II MPC82xx |
| Core Architecture | — | PowerPC G2 (32-bit) |
| Number of Cores | — | 1 |
| Operating Frequency | — | 266 MHz |
| Core Voltage | — | 2 V |
| I/O Voltage | — | 3.3 V |
| Ball Pitch | — | 1.0 mm (typical for 480-TBGA) |
| Packaging | — | Tray |
| Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Communications Processor Module (CPM) | — | Integrated RISC-based CPM with FCC/MCC/SCC |
| System Bus | — | 64-bit 60x bus |
| JTAG / COP Debug | — | Yes |