MPC8245LZU266D vs MPC8255ACVVMHBB 비교

다음의 상세 나란히 비교: MPC8245LZU266D 제조: NXP Semiconductors 및 MPC8255ACVVMHBB 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPC8245LZU266D MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D ✓ 활성
NXP Semiconductors
MPC8255ACVVMHBB MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP

MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP

MPC8255ACVVMHBB ✓ 활성

사양 비교

파라미터 MPC8245LZU266D MPC8255ACVVMHBB
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 활성
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale)
Series MPC82xx —
Part Status Active —
Core Processor PowerPC 603e —
Number of Cores / Bus Width 1 Core / 32-bit —
Speed (Clock Frequency) 266 MHz —
Performance 505.4 MIPS —
Co-Processor / DSP None —
RAM Controllers SDRAM —
Graphics Acceleration No —
Display & Interface Controllers [DATA_NEEDED: display controller details] —
Ethernet [DATA_NEEDED: integrated Ethernet?] —
PCI Interface 32-bit, 33/66 MHz —
Memory Controller Max Frequency 133 MHz (SDRAM), up to 2 GB —
Serial I/O I2C, UART, I2O —
공급 전압 3.3 V (typ.) —
Process Technology 0.25 um CMOS —
동작 온도 0 C to +105 C (commercial) —
패키지 352-TBGA (35 mm x 35 mm) 480-TBGA (37.5 x 37.5 mm)
실장 유형 Surface Mount —
Tray Quantity [DATA_NEEDED: tray qty per manufacturer packing] —
RoHS 상태 [DATA_NEEDED: confirm per lot] Compliant
Lead-Free Status Lead-free (BGA balls, SnAgCu) —
Part Family — PowerQUICC II MPC82xx
Core Architecture — PowerPC G2 (32-bit)
Number of Cores — 1
Operating Frequency — 266 MHz
Core Voltage — 2 V
I/O Voltage — 3.3 V
Ball Pitch — 1.0 mm (typical for 480-TBGA)
Packaging — Tray
Temperature Grade — Industrial
Lead Free — Yes
Communications Processor Module (CPM) — Integrated RISC-based CPM with FCC/MCC/SCC
System Bus — 64-bit 60x bus
JTAG / COP Debug — Yes

데이터시트 & 자료

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