MPC8245LZU266D vs MPC8255ACVVMHBB Comparaison
Comparaison détaillée côte à côte de MPC8245LZU266D par NXP Semiconductors et MPC8255ACVVMHBB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ ActifComparaison des spécifications
| Paramètre | MPC8245LZU266D | MPC8255ACVVMHBB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | — |
| Part Status | Active | — |
| Core Processor | PowerPC 603e | — |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | — |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| Tension d'alimentation | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| Température de fonctionnement | 0 C to +105 C (commercial) | — |
| Boîtier | 352-TBGA (35 mm x 35 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Type de montage | Surface Mount | — |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| Statut RoHS | [DATA_NEEDED: confirm per lot] | Compliant |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Part Family | — | PowerQUICC II MPC82xx |
| Core Architecture | — | PowerPC G2 (32-bit) |
| Number of Cores | — | 1 |
| Operating Frequency | — | 266 MHz |
| Core Voltage | — | 2 V |
| I/O Voltage | — | 3.3 V |
| Ball Pitch | — | 1.0 mm (typical for 480-TBGA) |
| Packaging | — | Tray |
| Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Communications Processor Module (CPM) | — | Integrated RISC-based CPM with FCC/MCC/SCC |
| System Bus | — | 64-bit 60x bus |
| JTAG / COP Debug | — | Yes |