MPC8245LZU266D vs MPC8255ACVVMHBB Comparação
Comparação detalhada lado a lado de MPC8245LZU266D por NXP Semiconductors e MPC8255ACVVMHBB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ AtivoComparação de especificações
| Parâmetro | MPC8245LZU266D | MPC8255ACVVMHBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | — |
| Part Status | Active | — |
| Core Processor | PowerPC 603e | — |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | — |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| Tensão de alimentação | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| Temperatura de operação | 0 C to +105 C (commercial) | — |
| Encapsulamento | 352-TBGA (35 mm x 35 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Tipo de montagem | Surface Mount | — |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| Status RoHS | [DATA_NEEDED: confirm per lot] | Compliant |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Part Family | — | PowerQUICC II MPC82xx |
| Core Architecture | — | PowerPC G2 (32-bit) |
| Number of Cores | — | 1 |
| Operating Frequency | — | 266 MHz |
| Core Voltage | — | 2 V |
| I/O Voltage | — | 3.3 V |
| Ball Pitch | — | 1.0 mm (typical for 480-TBGA) |
| Packaging | — | Tray |
| Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Communications Processor Module (CPM) | — | Integrated RISC-based CPM with FCC/MCC/SCC |
| System Bus | — | 64-bit 60x bus |
| JTAG / COP Debug | — | Yes |