MPC8245LZU266D vs MPC8255ACVVMHBB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8245LZU266D disebabkan oleh NXP Semiconductors dan MPC8255ACVVMHBB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ AktifPengandingan Spesifikasi
| Parametr | MPC8245LZU266D | MPC8255ACVVMHBB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | — |
| Part Status | Active | — |
| Core Processor | PowerPC 603e | — |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | — |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| Tegangan Pemberi Arus | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| Suhu Operasi | 0 C to +105 C (commercial) | — |
| Kemasan | 352-TBGA (35 mm x 35 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Jenis Pemasangan | Surface Mount | — |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| Status RoHS | [DATA_NEEDED: confirm per lot] | Compliant |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Part Family | — | PowerQUICC II MPC82xx |
| Core Architecture | — | PowerPC G2 (32-bit) |
| Number of Cores | — | 1 |
| Operating Frequency | — | 266 MHz |
| Core Voltage | — | 2 V |
| I/O Voltage | — | 3.3 V |
| Ball Pitch | — | 1.0 mm (typical for 480-TBGA) |
| Packaging | — | Tray |
| Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Communications Processor Module (CPM) | — | Integrated RISC-based CPM with FCC/MCC/SCC |
| System Bus | — | 64-bit 60x bus |
| JTAG / COP Debug | — | Yes |