XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
MPN: XPC8260CVVIFBC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $232 | $58,000.00 |
| 500 | $219.5 | $109,750.00 |
XPC8260CVVIFBC Overview
An embedded communications processor (sometimes called a network processor or comms MPU) is a specialized microprocessor that combines a general-purpose CPU core with dedicated hardware engines for fast packet handling, serial interfaces, and peripheral control. Within the broader hierarchy, the XPC8260CVVIFBC sits as PowerQUICC II -> PowerPC G2 -> PowerPC -> microprocessor -> MPU -> semiconductor, occupying a distinct niche between pure DSP engines and high-end general-purpose CPUs.
The part targets telecom and networking equipment where deterministic protocol processing, multiple fast serial channels, and a strong ARM-like peripheral set are required in a single chip. Its 480-TBGA package uses 37.5x37.5 mm of board area typical of top-side BGA-mounted ASIC-class processors requiring high pin count for parallel memory and serial IO. The device belongs to the legacy PowerQUICC II family (MPC82xx), historically produced by Motorola, then Freescale, and now NXP Semiconductors, which has continued second-source supply through partners like Rochester Electronics per the DigiKey record.
A practical tip when designing with this device: confirm lead-time early, because long-life PowerQUICC II parts are often sourced via distributor allocation or licensed aftermarket channels (NXP Rochester). Lifecycle status should be verified before committing to a new design, since mature MPU families may transition to NRND or Last-Time-Buy over time.
Typical applications include telecommunications line cards, networking routers and switches, industrial control, and embedded systems. Designers value its integrated CPM block, which offloads DMA, HDLC, ATM, and Ethernet handling from the main core.
When laying out the PCB, allocate at least one inner ground plane under the BGA and follow the NXP PowerQUICC II hardware design guide for high-speed signal integrity, decoupling, and JTAG boundary-scan hookup. Designers should validate thermal performance in production via simulation before finalizing the heatsink arrangement.
This page synthesizes distributor listings, cross-reference alternatives, design notes, and verified specifications not found in a single product summary - complementing the manufacturer datasheet with sourcing and lifecycle context for procurement and engineering teams.
Drop-in alternatives for XPC8260CVVIFBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XPC8260CVVIFBC (same form factor and footprint) — differing in Mounting Type, Communications Processor Module (CPM), Core Supply Voltage, Process Technology, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8260ACZUMIBB
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$200 / Unit
View Datasheet →MPC8260AZUPJDB
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$165 / Unit
View Datasheet →MPC8260AVVIFBC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XPC8260CVVIFBC Maximum Ratings & Electrical Characteristics
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | 200 MHz |
| Core Supply Voltage | 2.5 V |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) |
| Package / Case | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | Ball |
| Number of Terminals | 480 |
| Package Body Material | Plastic / Epoxy |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) |
| Series | PowerQUICC II (PQ II HIP 3) |
XPC8260CVVIFBC plastic / epoxy Pin Configuration Guide
Pin configuration for XPC8260CVVIFBC (plastic / epoxy package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XPC8260CVVIFBC.
Refer to the datasheet for full pin configuration.
Typical Applications
XPC8260CVVIFBC is suitable for 6 applications: Telecommunications Line Cards, Networking Routers and Switches, Industrial Control Systems, Embedded Networking Appliances, ATM/Frame Relay Edge Devices, Legacy Telecom Infrastructure Maintenance.
Telecommunications Line Cards
The XPC8260CVVIFBC's 200 MHz PowerPC G2 core plus integrated PowerQUICC II CPM makes it well suited to T1/E1 and DSL line cards where multiple HDLC channels and time-slot interchange must be handled deterministically. At 200 MHz the CPU has enough headroom to run a small RTOS for OAM&P while the CPM offloads DMA, ATM SAR, and Fast Ethernet MAC traffic in parallel. Typical implementations place the XPC8260CVVIFBC between a framer and a TDM switch, with 64-256 MB of SDRAM and 8 MB of boot Flash completing the node. The 480-LBGA's high pin count accommodates the parallel memory bus plus multiple SCC/SMC serial channels without external bus switching.
Recommended
Networking Routers and Switches
In mid-range enterprise routers and access switches the XPC8260CVVIFBC performs forwarding-plane packet classification while the CPM drives multiple 10/100 Ethernet MACs and HDLC uplinks. Its 200 MHz core can sustain a Linux or VxWorks control plane for routing daemons, SNMP, and CLI management, while hardware offloads free CPU cycles for data-plane throughput. Designers typically pair the chip with an external PCI bridge, a Marvell or Vitesse PHY, and 64-128 MB of 32-bit SDRAM. The result is a stable platform favored by long-life enterprise and SMB networking gear where the software investment outweighs the need for ARM-class newer silicon.
Recommended
Industrial Control Systems
The XPC8260CVVIFBC is widely deployed in industrial controllers where deterministic serial IO, long product lifecycles, and field-proven firmware are decisive. Its CPM provides SCC/SMC channels for RS-232/RS-485 fieldbuses and HDLC-based industrial protocols, while the 200 MHz core can run VxWorks, QNX, or an RTOS for SCADA logic. The plastic LBGA-480 package tolerates industrial -40C to +85C ambient operation typical of substation and factory-floor enclosures. The mature NXP supply chain plus Rochester Electronics aftermarket support means industrial OEMs can keep producing equipment for 10-20 years without forced redesign.
Recommended
Embedded Networking Appliances
Small-to-mid sized network appliances such as VPN concentrators, print servers, and protocol converters benefit from the XPC8260CVVIFBC's integrated CPM, which handles packet reassembly and serial bridging without burdening the host OS. At 200 MHz, it provides adequate CPU headroom for IPSec-lite, packet filtering, and management tasks while sustaining four to eight serial channels concurrently. Designers typically add 32-64 MB of SDRAM and 4 MB of boot Flash, keeping BOM cost low for high-volume appliance production. Field reliability at higher ambient temperatures makes the chip attractive for fanless industrial appliance designs.
Recommended
ATM/Frame Relay Edge Devices
Edge devices terminating ATM, Frame Relay, or multi-link PPP circuits rely on the XPC8260CVVIFBC's PowerQUICC II CPM to handle AAL1/AAL2 SAR, cell interleaving, and HDLC framing in hardware. The 200 MHz PowerPC G2 core runs control-plane routing protocols while the CPM sustains wire-rate layer-2 termination. Typical designs feed the CPM's TDM channels directly from a framer, then forward IP traffic to an Ethernet PHY, achieving deterministic latency for voice and leased-line services. The chip's deterministic DMA and time-slot interchange remain a strong differentiator versus newer generic CPUs without equivalent offload engines.
Recommended
Legacy Telecom Infrastructure Maintenance
Carriers and equipment vendors still maintain installed bases of PowerQUICC II-based switches and DSLAMs, creating an active service-replacement market for the XPC8260CVVIFBC. Rochester Electronics and licensed distributors provide long-term aftermarket supply, allowing service organizations to repair legacy line cards without redesigning the entire chassis. The deterministic CPM, mature VxWorks/POSIX software stack, and field-proven reliability make the chip irreplaceable for high-availability service contracts. Design teams maintaining such gear use the XPC8260CVVIFBC as a known-quantity repair component with predictable behavior across decades of field operation.
Recommended
Recommended Products Summary
Engineering reference data for XPC8260CVVIFBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8260ACZUMIBB | MPC8260AZUPJDB | MPC8260AVVIFBC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-LBGA (TBGA), 37.5x37.5 mm | 480-LBGA (TBGA) - same | 480-LBGA (TBGA) - same | 480-LBGA (TBGA) - same |
| Architecture | PowerPC G2 (PowerQUICC II, 1 core, 32-bit) | PowerPC G2 (PowerQUICC II) | PowerPC G2 (PowerQUICC II) | PowerPC G2 (PowerQUICC II) |
| CPM (Comms Processor Module) | Integrated (per PowerQUICC II) | Integrated | Integrated | Integrated |
| Number of Terminals | 480 (ball) | 480 (ball) | 480 (ball) | 480 (ball) |
| Packaging | Tray | Tray | Tray | Tray |
Key Differentiators
- Integrated PowerQUICC II CPM offloads serial and packet handling (vs MPC8260ACZUMIBB (same die family))
- Mature long-life supply via NXP and Rochester Electronics (vs Generic ARM Cortex MPU)
- 200 MHz PowerPC G2 deterministic performance (vs Lower-speed 100 MHz MPC82xx variant)
Design Notes
Estimated: at 2.5V core with typical 4-5W PowerQUICC II dissipation, plan PCB copper area of at least 25 cm x 25 cm and a thermal pad via array under the LBGA thermal balls, sized against the package thermal model for production. Industrial designs in sealed enclosures should derate CPU utilization to keep junction temperature under 100C for long-term reliability. For measurement, place a thermocouple near a center thermal ball and validate via a 30-minute worst-case load test in the actual chassis.
Allocate at least one continuous inner ground plane under the 37.5x37.5 mm LBGA to provide a low-impedance return path for the parallel memory bus plus 4-wire JTAG signals. Use microvia-in-pad or dog-bone fanout at 0.8-1.0 mm pitch to route the 480 balls cleanly, with matched-length traces for memory clock and byte-write strobes per the NXP PowerQUICC II hardware design guide. Verify BGA reflow profile conformance (RTS O2 < 50 ppm equivalent) to avoid board warpage and solder joint defects at production reflow.
Series-terminate the external memory data/address bus near the XPC8260CVVIFBC balls to dampen reflections on the high-pin-count BGA memory interface. JTAG TCK should be EMC-filtered to keep boundary-scan reliability intact in noisy telecom environments. CPM serial lines (SCC/SMC) benefit from series ferrite beads when fed to external PHYs or framers to meet typical ETSI/EN55022 emissions levels.
Compliance Information
RoHS/lead-free status not present in verified web data; the XPC prefix historically denotes 'no PB' lead finish per legacy Freescale encoding but is not authoritative for current EU RoHS - confirm against the latest NXP material declaration before shipping to RoHS-restricted markets.
