MPC8306VMABDCA vs MPC8306SCVMABDCA Comparison
Detailed side-by-side comparison of MPC8306VMABDCA by NXP Semiconductors and MPC8306SCVMABDCA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ End of LifeNXP Semiconductors
MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
MPC8306SCVMABDCA ✗ End of LifeSpecification Comparison
| Parameter | MPC8306VMABDCA | MPC8306SCVMABDCA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $16.10 | $26.40 |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | 1 |
| Data Bus Width | 32 bit | 32 bit |
| Core Frequency | 133 MHz | — |
| Memory Controller | DDR2 with ECC | DDR2 |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Package | 369-LFBGA (19x19 mm) | 369-PBGA MAP-BGA (19x19 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Temperature | 0 °C to +105 °C | -40C to +105C (extended) |
| RoHS Status | [DATA_NEEDED: rohs status] | Compliant |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core | — | PowerPC e300c3 |
| Architecture | — | Power Architecture, 32-bit |
| Maximum Core Frequency | — | 133 MHz |
| Local Bus | — | 16-bit |
| Communications Engine | — | QUICC Engine (HDLC, TDM) |
| Time Synchronization | — | IEEE 1588 v2 |