MPC8360EVVAGDGA vs MPC8360EZUAGDGA Comparison
Detailed side-by-side comparison of MPC8360EVVAGDGA by NXP Semiconductors and MPC8360EZUAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8360EVVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | Active |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | — |
| Data Bus Width | 32-bit | 32-bit |
| Maximum Clock Frequency | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | 32-bit PCI |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 1 Gbit (10/100/1000) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | USB 2.0 full/low-speed |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Operating Temperature Range | 0C to +105C (TA) | — |
| Package | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| RoHS Status | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | MPC8360E |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Mounting Type | Surface Mount (TBGA ball grid) | Surface Mount |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Supply Voltage | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| Memory Interface | — | DDR1 / DDR2 |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Operating Temperature | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |