MPC8360EVVAGDGA vs MPC8360EZUAGDGA Comparação
Comparação detalhada lado a lado de MPC8360EVVAGDGA por NXP Semiconductors e MPC8360EZUAGDGA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraComparação de especificações
| Parâmetro | MPC8360EVVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Ativo |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | — |
| Largura do barramento de dados | 32-bit | 32-bit |
| Frequência máxima de clock | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | 32-bit PCI |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 1 Gbit (10/100/1000) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | USB 2.0 full/low-speed |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Faixa de temperatura de operação | 0C to +105C (TA) | — |
| Encapsulamento | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| Status RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | MPC8360E |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Tipo de montagem | Surface Mount (TBGA ball grid) | Surface Mount |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Tensão de alimentação | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| Memory Interface | — | DDR1 / DDR2 |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Temperatura de operação | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |