MPC8360EVVAGDGA vs MPC8360EZUAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8360EVVAGDGA par NXP Semiconductors et MPC8360EZUAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8360EVVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Actif |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | — |
| Largeur du bus de données | 32-bit | 32-bit |
| Fréquence d'horloge maximale | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | 32-bit PCI |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 1 Gbit (10/100/1000) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | USB 2.0 full/low-speed |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Plage de température de fonctionnement | 0C to +105C (TA) | — |
| Boîtier | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| Statut RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | MPC8360E |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Type de montage | Surface Mount (TBGA ball grid) | Surface Mount |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Tension d'alimentation | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| Memory Interface | — | DDR1 / DDR2 |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Température de fonctionnement | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |