MPC8360EVVAGDGA vs MPC8360EZUAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360EVVAGDGA von NXP Semiconductors und MPC8360EZUAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8360EVVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | — |
| Datenbusbreite | 32-bit | 32-bit |
| Maximale Taktfrequenz | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | 32-bit PCI |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 1 Gbit (10/100/1000) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | USB 2.0 full/low-speed |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Betriebstemperaturbereich | 0C to +105C (TA) | — |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| RoHS-Status | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | MPC8360E |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Montageart | Surface Mount (TBGA ball grid) | Surface Mount |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Versorgungsspannung | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| Memory Interface | — | DDR1 / DDR2 |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Betriebstemperatur | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |