MPC8360EZUAGDGA vs MPC8360ZUAGDGA Comparison
Detailed side-by-side comparison of MPC8360EZUAGDGA by NXP Semiconductors and MPC8360ZUAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC8360EZUAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Architecture | PowerPC e300 (Power Architecture) | 32-Bit Power Architecture |
| Core Count | 1 | 1 |
| Data Bus Width | 32-bit | — |
| Core Clock Speed | 400 MHz | 400 MHz |
| Supply Voltage | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | DDR1/DDR2 controller with ECC |
| Ethernet | 1 Gbit (10/100/1000) | 1 x 10/100/1000 (Gigabit Ethernet) |
| PCI Interface | 32-bit PCI | 32-bit / 66 MHz PCI |
| USB | USB 2.0 full/low-speed | — |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| Package | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | — |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | — |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C |
| Mounting Type | Surface Mount | — |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | — |
| Processor Type | — | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Voltage | — | 1.2 V |
| Package / Case | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| USB Interface | — | USB 2.0 Full-Speed |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| RoHS Status | — | Compliant |
| Lead Free Status | — | Lead Free |