MPC8360EZUAGDGA vs MPC8360ZUAGDGA Comparación
Comparación detallada lado a lado de MPC8360EZUAGDGA por NXP Semiconductors y MPC8360ZUAGDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC8360EZUAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Architecture | PowerPC e300 (Power Architecture) | 32-Bit Power Architecture |
| Core Count | 1 | 1 |
| Ancho del bus de datos | 32-bit | — |
| Core Clock Speed | 400 MHz | 400 MHz |
| Tensión de alimentación | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | DDR1/DDR2 controller with ECC |
| Ethernet | 1 Gbit (10/100/1000) | 1 x 10/100/1000 (Gigabit Ethernet) |
| PCI Interface | 32-bit PCI | 32-bit / 66 MHz PCI |
| USB | USB 2.0 full/low-speed | — |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| Encapsulado | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | — |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | — |
| Temperatura de funcionamiento | 0 C to 105 C | 0 C to 105 C |
| Tipo de montaje | Surface Mount | — |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | — |
| Processor Type | — | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Voltage | — | 1.2 V |
| Encapsulado / Carcasa | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| USB Interface | — | USB 2.0 Full-Speed |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| Estado RoHS | — | Compliant |
| Lead Free Status | — | Lead Free |