MPC8360EZUAGDGA vs MPC8360ZUAGDGA 对比

详细并排对比 MPC8360EZUAGDGA 出自 NXP Semiconductors 和 MPC8360ZUAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8360EZUAGDGA MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA ✓ 量产中
NXP Semiconductors
MPC8360ZUAGDGA MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA ✓ 量产中

规格对比

参数 MPC8360EZUAGDGA MPC8360ZUAGDGA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
Architecture PowerPC e300 (Power Architecture) 32-Bit Power Architecture
Core Count 1 1
数据总线宽度 32-bit —
Core Clock Speed 400 MHz 400 MHz
电源电压 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] —
Memory Interface DDR1 / DDR2 DDR1/DDR2 controller with ECC
Ethernet 1 Gbit (10/100/1000) 1 x 10/100/1000 (Gigabit Ethernet)
PCI Interface 32-bit PCI 32-bit / 66 MHz PCI
USB USB 2.0 full/low-speed —
TDM / ATM Yes (TDM and ATM) —
Security Accelerator SEC (crypto engine) —
封装 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch —
Package Height 1.46 mm —
Lead-Free / RoHS Lead-free (per datasheet) —
工作温度 0 C to 105 C 0 C to 105 C
安装类型 Surface Mount —
Product Family MPC83xx PowerQUICC II Pro —
Series MPC8360E —
Processor Type — PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro)
Core Voltage — 1.2 V
封装 / 外壳 — 740-LBGA / 740-TBGA (37.5 x 37.5 mm)
Packaging — Tray
USB Interface — USB 2.0 Full-Speed
TDM / Serial — Multiple TDM channels (T1/E1/J1/HDLC/ATM)
Revision — Revision 2.x TBGA
Encryption — Non-encryption variant (no SEC 2.0)
RoHS 状态 — Compliant
Lead Free Status — Lead Free

数据手册与资源

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