MPC8360EZUAGDGA vs MPC8360ZUAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360EZUAGDGA von NXP Semiconductors und MPC8360ZUAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC8360EZUAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Architecture | PowerPC e300 (Power Architecture) | 32-Bit Power Architecture |
| Core Count | 1 | 1 |
| Datenbusbreite | 32-bit | — |
| Core Clock Speed | 400 MHz | 400 MHz |
| Versorgungsspannung | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | DDR1/DDR2 controller with ECC |
| Ethernet | 1 Gbit (10/100/1000) | 1 x 10/100/1000 (Gigabit Ethernet) |
| PCI Interface | 32-bit PCI | 32-bit / 66 MHz PCI |
| USB | USB 2.0 full/low-speed | — |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| Gehäuse | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | — |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | — |
| Betriebstemperatur | 0 C to 105 C | 0 C to 105 C |
| Montageart | Surface Mount | — |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | — |
| Processor Type | — | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Voltage | — | 1.2 V |
| Gehäuse / Bauform | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| USB Interface | — | USB 2.0 Full-Speed |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| RoHS-Status | — | Compliant |
| Lead Free Status | — | Lead Free |