MPC8360VVAGDGA vs MPC8360EZUAGDGA Comparison
Detailed side-by-side comparison of MPC8360VVAGDGA by NXP Semiconductors and MPC8360EZUAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC8360VVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Active |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | — |
| Data Bus Width | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | MPC8360E |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | — |
| Operating Temperature Range | 0C to +105C | — |
| Package | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller | DDR1 / DDR2 |
| PCI Interface | 32-bit PCI v2.3 | 32-bit PCI |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1 Gbit (10/100/1000) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 full/low-speed |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Supply Voltage | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Operating Temperature | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |