MPC8360VVAGDGA vs MPC8360EZUAGDGA 对比
详细并排对比 MPC8360VVAGDGA 出自 NXP Semiconductors 和 MPC8360EZUAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC8360VVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | — |
| 数据总线宽度 | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | MPC8360E |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | — |
| 工作温度范围 | 0C to +105C | — |
| 封装 | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| 安装类型 | Surface Mount | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller | DDR1 / DDR2 |
| PCI Interface | 32-bit PCI v2.3 | 32-bit PCI |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1 Gbit (10/100/1000) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 full/low-speed |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| 电源电压 | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| 工作温度 | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |